NovelRank

3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics)

Hardcover

The hardcover of 3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics) is currently ranked 740,935 on Amazon.com according to NovelRank's collected data. Published by Springer, the book's Amazon sales rank has been tracked for a long time, starting on March 10, 2017. In that time, authors Yan Li, Deepak Goyal have seen the book peak at a ranking of 116,585. However, NovelRank is not actively tracking the sales rank of this book.

You can view charts and see full ranking and sales data across all worldwide Amazon domains by viewing the full detail page on NovelRank.com.